Amakhono okukhiqiza e-PCB athuthukisiwe, agxile ezintweni ezinembile kakhulu, ezinzima kakhulu, nezikhethekile, akhonza izimboni ezifana nocwaningo lwesayensi, i-RF, ezempi, ezokwelapha, amarobhothi, kanye ne-AI.
I-HDI PCB
Kuyini i-HDI PCB?
▶ I-HDI PCB (i-High Density Interconnect PCB) ibhekisela ebhodini lesifunda eliphrintiwe elixhumanisayo elinobukhulu obuphezulu. Isici sayo esiyinhloko ukufeza ukuxhumana phakathi kwezingqimba zethusi ezahlukene ngokusebenzisa ama-micro blind vias abhobozwe nge-laser kanye nama-billed vias. Uma kuqhathaniswa nama-PCB endabuko, ingahlanganisa ama-circuits amaningi kanye nezingxenye endaweni encane, futhi ivame ukusetshenziswa emikhiqizweni ye-elekthronikhi emincane efana nama-smartphone namadivayisi agqokwayo.
▶ Ama-PCB e-HDI ahlukaniswa ngezinhlobo eziphansi (isb., i-oda lokuqala, i-oda lesibili) kanye nezinhlobo eziphansi (i-oda lesithathu nangaphezulu) ngokusekelwe enanini lezendlalelo ezakhelwe phezulu. Imikhiqizo esezingeni eliphezulu ivame ukusebenzisa ubuchwepheshe bokuxhumana obunezendlalelo zanoma yiluphi. Ngokufinyeza izindlela zesignali ngama-microvia, ithuthukisa ubuqotho besignali futhi ivumelane nezimo zokudlulisa idatha ezisheshayo nezinemvamisa ephezulu.
Izinto Okucatshangwa Ngazo Ngomklamo we-HDI PCB
Izinto Okucatshangwa Ngazo Ngomklamo | Imininingwane kanye nezincazelo |
Ukulawulwa Kobubanzi Bomugqa kanye Nesikhala | Ngezinqubo ezijwayelekile, ububanzi bomugqa obuncane kanye nesikhala kunconywa ukuthi kungabi ngaphansi kuka-4mil (cishe u-0.1mm). Nakuba izinqubo eziphezulu zingasekela u-3mil noma ngisho no-2.5mil, kufanele kugcinwe umkhawulo ongaphezu kuka-20% ukuvimbela ukuphuka kwentambo, amasekethe amafushane, nezinye izinkinga ngesikhathi sokusika. |
Ngomklamo Wesakhiwo | Beka phambili ukulawula ama-laser blind vias kuma-oda angu-1-2 anosayizi we-via ongaphansi kuka-0.15mm; uma usebenzisa i-via-in-pad kumaphakheji e-BGA, kudingeka ukwakheka kokufaka imigodi efanele; sebenzisa ama-step blind vias ngangokunokwenzeka futhi unciphise ama-stacked blind vias ukuze unciphise ingozi yokuphambuka kokuqondanisa. |
Ukuthuthukiswa Kokuhlela I-Stackup | Hlukanisa imisebenzi yesendlalelo ngasinye ngokwezinhlobo zesignali kusengaphambili. Isibonelo, sebenzisa ukwakheka okushintshanayo kwezingqimba zesignali, izingqimba zomhlabathi, kanye nezingqimba zamandla (isb., isendlalelo sokuqala: isendlalelo sesignali, isendlalelo sesibili: isendlalelo somhlabathi, isendlalelo sesithathu: isendlalelo samandla) ukuze uthuthukise ukuhambisana kwe-electromagnetic (EMC) kanye nokuqina kwesignali. |
Umklamo wePad kanye neThermal | Ububanzi bephedi bunconywa ukuthi bube bukhulu kuno-0.3mm, kube nesikhala esifanele kuma-via; khetha izinto ezihambisa ukushisa njengezinto zobumba, engeza amabhlogo ethusi noma ama-via okushisa ngaphansi kwezingxenye ezikhiqiza ukushisa, bese wandisa izendlalelo zokuqinisa i-copper foil ukuze wandise indawo yokushabalalisa ukushisa. |
Ukucatshangelwa Kokukhiqizwa | Landela izindinganiso zokuklama ezifana ne-IPC-2226 futhi ugcine ukubekezelelana kokukhiqiza okungu-10%–20% kumapharamitha. Isibonelo, i-offset phakathi kwe-pad centre kanye ne-via centre akufanele idlule u-0.075mm ukuze ugweme ukuphinda usebenze okubangelwa amapharamitha asondele kakhulu emikhawulweni yenqubo. |
Izinto Okucatshangwayo Ngokukhiqizwa kwe-HDI PCB
Izinto Okucatshangelwayo Ngokukhiqiza | Imininingwane kanye nezincazelo |
Ukulawula Ukuhambisana Kwezinto Ezibalulekile | Uma ukhetha ama-substrate, ama-prepreg, nezinye izinto, fanisa ama-coefficients azo okwandisa ukushisa (i-CTE) ukuze ugweme ukugoba kanye nokuhlukanisa ngemva kokubopha; qinisekisa ukuhambisana kwezinto ngokuhlola kwangaphambi kwesikhathi uma kudingeka, bese ukhetha ama-inki emaski e-solder anokunamathela okunamandla kanye nokumelana okuhle nokushisa. |
Ukulawula Ukuchaneka Kwe-Lamination | Sebenzisa izinhlelo zokuqondanisa ezinembile kakhulu ukulawula amaphutha okulinganisa phakathi kwezingqimba ngesikhathi sokulamina ibhodi elinezingqimba eziningi; beka phambili ukulamana okulinganayo okulinganayo futhi ugcine amapharamitha okulamina azinzile ngaphakathi kobubanzi obufanele ukuvimbela amaphutha afana namabhamuza kanye nokugcwaliswa kwe-resin okunganele. |
Ikhwalithi Yokucubungula i-Microvia | Sebenzisa imishini yokubhoboza nge-laser ukuqinisekisa ukunemba komgodi ophakathi kwama-microvia angu-0.1mm–0.15mm, bese ususa ngokushesha ukungcola okusele ezindongeni zemigodi ngemva kokubhoboza; ngesikhathi sokufakwa kwe-copper less electrolyte kanye ne-copper electrolytic, qinisekisa ukufakwa kwe-plating efanayo ezindongeni zemigodi ukuze ugweme izikhala kanye nokuqhekeka. |
Ukuhlanzeka Nokulawulwa Kwemvelo | Gcina izinga eliphezulu lokuhlanzeka endaweni yokukhiqiza; susa ngokuphelele ukungcola ngemva kwezinqubo ezifana nokusika nokuhlanza ukuze uvimbele ukuqhekeka kwama-plating kanye nokwehluleka kwesekethe kwama-microvia nama-fine circuits ngenxa yokungcola. |
Izinqubo Zokuhlola Ezithuthukisiwe | Sebenzisa imishini ye-AOI (Automated Optical Inspection) ukuthola amaphutha ebusweni besekethe; sebenzisa i-X-ray ukuhlola ukuhambisana kwe-vias ezingaboni/i-vias ezingcwatshwe kanye nekhwalithi ye-BGA solder joint; qinisekisa ukusebenza kukagesi ngokusebenzisa izivivinyo ze-flying probe kanye ne-ICT (In-Circuit Test) ukuqinisekisa ukuthi ukuphambuka kwe-impedance kungaphakathi kwebanga elifanele. |
Ukulinganiswa Kwemishini Nezinqubo | Lungisa njalo imishini efana nemishini yokubhoboza ye-CNC kanye nama-laminator, futhi uqaphe amapharamitha abalulekile ngesikhathi sangempela njengokushisa kwe-lamination kanye nogesi wamanje; sungula izinqubo zokusebenza ezijwayelekile zezinqubo ezifana nokusika nokuthuthukiswa ukuze kuncishiswe ukuguquguquka kwenqubo. |
Umehluko Phakathi kwe-PCB Ejwayelekile ne-HDI PCB
▶Isingeniso ku-Common PCB
*I-PCB (Ibhodi Lesekethe Eliphrintiwe), eyaziwa nangokuthi ibhodi lezintambo eziphrintiwe ngesiShayina, iyisici esibalulekile se-elekthronikhi. Isebenza njengokusekela izingxenye ze-elekthronikhi kanye nesithwali sokuxhumeka kwazo kagesi. Ngenxa yokuthi yenziwe ngobuchwepheshe bokuphrinta nge-elekthronikhi, ibizwa ngokuthi ibhodi lesekethe "eliphrintiwe".
Umsebenzi wayo oyinhloko ukuthi ngemva kokuba amadivayisi kagesi esebenzise amabhodi wesekethe aphrintiwe, ngenxa yokuvumelana kwamabhodi wesekethe aphrintiwe afanayo, amaphutha ekuxhunyweni kwezintambo ngesandla ayagwenywa. Ingaphinde ifinyelele ukufakwa okuzenzakalelayo noma ukufakwa kwendawo yezingxenye ze-elekthronikhi, ukushiswa okuzenzakalelayo, kanye nokutholwa okuzenzakalelayo, ukuqinisekisa ikhwalithi yamadivayisi kagesi, ukuthuthukisa umkhiqizo wabasebenzi, ukunciphisa izindleko, kanye nokwenza lula ukulungiswa.
*Amabhodi e-HDI angamabhodi wesekethe esixhumanisayo esinobukhulu obuphezulu. Amabhodi ane-electroplating yembobo engaboni kanye ne-lamination yesibili wonke angamabhodi e-HDI, ahlukaniswe nge-oda lokuqala, i-oda lesibili, i-oda lesithathu, i-oda lesine, i-oda lesihlanu, njll. Isibonelo, ibhodi elikhulu le-iPhone 6 liyi-HDI ye-oda lesihlanu.
| IKHONO LE-HDI | |||||
| I-HDI PCB | Ububanzi bezinyathelo ze-HDI PCB | Izinyathelo ezi-1-3 ze-HDI | 1-6Izinyathelo ze-HDI | ||
| Ububanzi bemigodi ye-laser | 4-6MIL | 3-6MIL | |||
| Isilinganiso Sokubukeka Kwe-Laser Blind Via | Isinyathelo esi-1 | 0.5∶1 ～ 0.8∶1 | ≤0.9∶1 | ||
| Izinyathelo ezi-2 noma ngaphezulu | 0.5∶1 ～ 0.8∶1 | 0.5∶1 ～ 0.8∶1 | |||
| Ubukhulu be-Dielectric be-Laser Blind Via | 2.5～4MIL | 2.5～5MIL | |||
| Indandatho Engaphansi Yephedi Engezansi (mil) | D+8MIL（D Laser Via Diameter） | D+6MIL（D Laser Via Diameter） | |||
| Indandatho Engafiphali Ye-Laser Nge-Pad Annular | Isinyathelo esi-1 | 4MIL | 4MIL | ||
| Izinyathelo ezi-2 noma ngaphezulu | 5MIL | 4MIL | |||
| Ukuphuma/Ukucindezeleka Okuncane Nge-Micro Via Fill (Ubuningi) | Ukuphakama okuphezulu okungu-50μm, ukucindezeleka okuphezulu okungu-127μm | ||||
| Usayizi Wephaneli Ophezulu | Ubukhulu | Usayizi wephaneli≤415*520MM (usayizi wokuthumela: 375*480MM） | |||
| Ubukhulu ≥0.6MM | Usayizi wephaneli≤470*620MM (usayizi wokuthumela: 430*580MM） | ||||
Imibuzo Evame Ukubuzwa
Q1: Yiziphi izinhlobo ezivamile zama-PCB e-HDI?
A: Ama-PCB e-HDI ngokuvamile asebenzisa ama-microvia anobubanzi obusukela ku-50-150μm (2-6 mils), amancane kakhulu kune-PCB vias yendabuko engu-250-300μm.
UMBUZO 2: Ama-HDI PCB amancane kangakanani uma eqhathaniswa nama-PCB endabuko?
A: Ubuchwepheshe be-HDI bunganciphisa usayizi webhodi ngo-30-70% ngenkathi kugcinwa noma kuthuthukiswa ukusebenza, kuye ngokuthi uhlelo lokusebenza luyinkimbinkimbi kangakanani.
Umbuzo 3: Yiziphi izimboni ezizuza kakhulu kubuchwepheshe be-HDI?
A: Izimboni ze-elekthronikhi zabathengi, izimoto, amadivayisi ezokwelapha, izindiza kanye nezokuxhumana zibona izinzuzo ezinkulu kakhulu ezivela ekuncipheni nasekusebenzeni kobuchwepheshe be-HDI.
UMBUZO 4: Ingabe ama-PCB e-HDI abiza kakhulu kune-PCB yendabuko?
A: Nakuba ama-PCB e-HDI enezindleko eziphezulu ngesikwele ngasinye, izindleko zesistimu iyonke zivame ukwehla ngenxa yezindawo ezincane zokuvala, ukuncipha kobunzima bokuhlanganisa, kanye nokusebenza okuthuthukisiwe.
Umbuzo 5: Yisiphi isofthiwe yokuklama enconyelwa ukuklama i-HDI PCB?
A: Amathuluzi ochwepheshe afana ne-Altium Designer, i-Cadence Allegro, kanye ne-Mentor Graphics ahlinzeka ngezici ezithile ze-HDI okuhlanganisa imithetho yokuklama i-microvia kanye nokuphathwa kwe-stackup okuthuthukisiwe.
Umbuzo 6: Ngokuvamile kuthatha isikhathi esingakanani ukwenziwa kwe-HDI PCB?
A: Ukwenziwa kwe-HDI PCB ngokuvamile kudinga amasonto ama-2-4 kuye ngokuthi kuyinkimbinkimbi kangakanani, inani lezingqimba, kanye namakhono omkhiqizi, isikhathi eside kune-PCB yendabuko ngenxa yezinqubo zokwakheka ezilandelanayo.
Umbuzo 7: Yikuphi ukuqedwa kobuso okungcono kakhulu kuzinhlelo zokusebenza ze-HDI?
A: I-ENIG (i-Electroless Nickel Immersion Gold) ikhethwa kakhulu ezinhlelweni ze-HDI ngenxa yokukwazi kwayo ukunamathela kahle, ikhono lokubopha izintambo, kanye nokuhambisana kahle kwephimbo.
Thumela umbuzo
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