Amakhono okukhiqiza e-PCB athuthukisiwe, agxile ezintweni ezinembile kakhulu, ezinzima kakhulu, nezikhethekile, akhonza izimboni ezifana nocwaningo lwesayensi, i-RF, ezempi, ezokwelapha, amarobhothi, kanye ne-AI.
I-PCB Yethusi Enzima
Iyini i-PCB ye-Heavy Copper?
▶I-core isetshenziswa ezimweni zamandla aphezulu kanye namandla aphezulu (njengokunikezwa kwamandla, amandla amasha, ukulawulwa kwezimboni, njll.). Amaphuzu abalulekile okuklama, ukukhiqizwa kanye nokusetshenziswa kwayo yile:
Izici eziyinhloko kanye nezimo zohlelo lokusebenza
Izinzuzo eziyinhloko
• Umthamo oqinile wokuthwala ugesi: Umthamo wokuthwala ugesi we-foil yethusi engu-70μm (ama-ounces amabili) cishe uphindwe kabili kunomthamo we-foil yethusi engu-35μm (i-ounce elilodwa) (ngaphansi kobubanzi bomugqa ofanayo).
• Ukushabalalisa ukushisa okuhle: Ingqimba yethusi ejiyile ingasheshisa ukushisa, inciphise ingozi yokushisa ngokweqile kwedivayisi.
• Amandla aphezulu omshini: Ithusi elijiyile lithuthukisa ukumelana kwe-PCB ekugobeni nasekushayweni.
Izinhlelo zokusebenza ezijwayelekile
• Ama-Power converter (AC-DC/DC-DC), ama-BMS ezimoto ezintsha zamandla, ama-frequency converter ezimboni, amabhodi okulawula emishini yokushisela, njll.
Amaphuzu abalulekile okuklama
1. Ukukhethwa kobukhulu be-foil yethusi
• Imininingwane evamile: 70μm (2 ounces), 105μm (3 ounces), 140μm (4 ounces), kanye no-420μm (12 ounces) ezimweni ezimbi kakhulu.
• Izimo zokufanisa: Kumasekethe amakhulu kagesi (≥5A), ama-ounces amabili kuya kwamane ethusi kufanele akhethwe. Kumasekethe amakhulu kakhulu (≥20A), ama-ounces angu-6 kuya kwayishumi nambili ethusi kufanele akhethwe.
2. Umklamo womthamo wokulandelela kanye nowokuthwala ugesi
• Ukubalwa komthamo wokuthwala amandla kagesi:
• Umthamo wokuthwala ugesi womkhondo wethusi ojiyile udinga ukuhlanganiswa nobukhulu bethusi, ububanzi bomugqa, kanye nezidingo zokwenyuka kwezinga lokushisa (ngokuvamile eziklanywe ngokusekelwe ekukhuphukeni kwezinga lokushisa okungu-10℃).
• Ireferensi yefomula ithi: \(I = K \times W \times T^{0.83}\) (I ingumshini wamanje, u-K uyi-coefficient, u-W ububanzi bomugqa, kanti u-T ubukhulu bethusi). Isibonelo: ama-ounces amabili ethusi (70μm), ububanzi bentambo buyi-5mm, umthamo wokuthwala wamanje cishe u-15A (ukuphakama kwezinga lokushisa ngu-10℃).
• Ukulungiswa kokulandelela:
• Ukuze uthole imikhondo enamandla okushisa, yigcine imfushane futhi ibanzi ngangokunokwenzeka ukuze ugweme izintamo ezincane (ushintsho olusheshayo ebubanzini bomugqa lungabangela kalula ukushisa ngokweqile kwendawo).
• Isekethe yamandla aphezulu yamabhodi anezingqimba eziningi ingasebenzisa "ukuxhumeka okuhambisanayo kwezingqimba eziningi ze-foil yethusi" (isibonelo, izingqimba ezimbili zama-ounces amabili ethusi zilingana nama-ounces angu-4) ukuze kuthuthukiswe amandla okuthwala amandla kagesi.
3. Umklamo we-Via kanye ne-pad
• Ama-Via: Kuma-via anomoya ophakeme, ububanzi bembobo kufanele bukhuliswe (≥0.5mm), inani lama-via kufanele likhuliswe (kulinganiselwa ku-1A ngomgodi ngamunye), kanti ubukhulu be-copper plating odongeni lomgodi kufanele bube yi-≥20μm (8 kuya ku-12μm kuma-PCBS ajwayelekile).
• Amaphedi: Amaphedi ethusi aqinile adinga ukwandiswa ngobukhulu (amakhulu ngo-0.2 kuya ku-0.5mm kunamaphedi avamile) ukuvimbela ungqimba lwethusi ukuthi lungachithi ukushisa ngokushesha ngesikhathi sokushisela, okungaholela ekushiseni okungamanga.
4. Ukushabalalisa ukushisa kanye nomklamo wokushisa
• Ukushabalalisa Ukushisa: Indawo yethusi ejiyile ingaklanywa njenge-"copper sheet heat sink", noma i-metallised via array (ngokusebenzisa isikhala esingu-≤1mm) ingangezwa ukuze ixhunywe kungqimba lokushabalalisa ukushisa.
• Ukufakwa komoya: Isikhala sentambo sezendlalelo zethusi ezijiyile kufanele sandiswe (ngethusi elingu-70μm, isikhala sentambo esihambisanayo kufanele sibe ngu-≥0.2mm) ukuvimbela ukuwohloka komoya ngaphansi kwamandla aphezulu.
Ubunzima kanye nokulawula inqubo yokukhiqiza
▶ 1. Ukubopha nokubopha nge-copper foil
Ukushibilika kwethusi okujiyile: Ukushibilika kwethusi okunokushisa okuphezulu kanye nokucindezela okuphezulu (180℃/4MPa) kuyadingeka ukuqinisekisa amandla okuqhekeka phakathi kwe-foil yethusi kanye ne-substrate (≥1.2N/mm).
Ukugcaba kwethusi okujiyile: Izinga lokugcaba lihamba kancane (cishe i-1μm/min), futhi isikhathi sokugcaba sidinga ukulawulwa ukuze kugwenywe ukugcaba eceleni (inani lokugcaba eceleni ≤0.05mm). Inqubo yokugcaba ngesinyathelo ngesinyathelo kufanele isetshenziswe ukunciphisa ukuphambuka kobubanzi bomugqa.
▶ 2. Ukulawula i-lamination kanye ne-warpage
I-coefficient of thermal expansion (CTE) yezingqimba zethusi ezijiyile ihluke kakhulu kweye-substrate. Lapho kulayishwa, kufanele kusetshenziswe "isakhiwo esilinganayo" (esine-copper thickness efanayo phakathi kwezingqimba eziphezulu nezingezansi) futhi kufanele kufakwe isendlalelo esiqinile sokusekela ukuvimbela ukugoba kwe-PCB (i-warping degree ≤0.5%).
▶ 3. Ukwelashwa kobuso
Ubuso bethusi obukhulu buvame ukubola. Kungcono ukukhetha i-tin plating (ungqimba lwe-tin olushisa kakhulu) noma i-nickel-gold plating ukuze ugweme i-OSP (ukumbozwa kwefilimu ephilayo engaphelele).
Indawo yephedi idinga ukwandiswa ngefasitela elivula imaski yokubopha ukuqinisekisa amandla okubopha phakathi kwe-solder kanye nethusi elijiyile.
Isifinyezo esiyinhloko
Ingqikithi yama-PCB ethusi anzima "umthamo wokuthwala wamandla aphezulu + ukushabalaliswa kokushisa". Ngokuphathelene nomklamo, kuyadingeka ukuhambisana nobukhulu bethusi kanye nezidingo zamandla okuthwala wamandla amanje. Ekukhiqizeni, izinkinga ezifana nokugqwala kwethusi okujiyile kanye nokugoba kwe-lamination zidinga ukuxazululwa. Zifanele izimo zezimboni namandla ezinamandla aphezulu kanye namandla aphezulu.
Thumela umbuzo
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