Kuyini i-PCB?

Kuyini ukukhiqizwa kwe-PCB? Ubuciko Bokudala Isisekelo Sezinto Eziphathekayo

AI-PCB (Ibhodi Yesekethe Ephrintiwe)iyisakhiwo esiyisisekelo cishe sazo zonke izisetshenziswa zesimanje ze-elekthronikhi. Kuyipulatifomu ebonakalayo esekela ngomshini futhi ixhumanise izingxenye ze-elekthronikhi ngogesi isebenzisa amathrekhi okuhambisa, ama-pad, nezinye izici eziqoshwe ngamashidi ethusi abekwe phezu kwe-substrate engahambisani nokuhambisa.
Cabanga ngakho njengeuhlelo lwezinzwanomauhlaka kanye nemigwaqoyomkhiqizo we-elekthronikhi, ohlinzeka ngesakhiwo kanye nezindlela zezimpawu kanye namandla okuhamba.

Isinyathelo 2: Ukuphrinta Izendlalelo Zangaphakathi
Umklamo uphrintwa efilimini, bese isetshenziselwa ukudlulisa iphethini yesekethe enkabeni yebhodi. Inkaba yibhodi eliyi-laminate elimbozwe ungqimba lwethusi. Kusetshenziswa ifilimu ezwela ukukhanya ebizwa ngokuthi i-photoresist. Ngaphansi kokukhanya kwe-UV, izingxenye ezicacile zefilimu ziqinisa i-photoresist, "ziphrinte" iphethini yesekethe ethusini.

Isinyathelo 3: Ukuqopha Ithusi
Ibhodi libe selithuthukiswa, lihlanza i-photoresist engaqinisiwe. Ibhodi lidlula enkambisweni yokuqopha, lapho isisombululo samakhemikhali sisusa khona ithusi elingafuneki, eliveziwe, kushiye kuphela iminonjana yethusi evikelwe yi-resist eqinile.

Isinyathelo 4: Ukulungiswa Kwezingqimba Nokugcotshwa Kwelayini
Ama-PCB esimanje avame ukuba nezingqimba eziningi. Izingqimba zangaphakathi (ngemva kokuqoshwa) zihlanganiswa ndawonye ngezingqimba ze-prepreg (into yokubopha efakwe ngaphambi kokufakwa) kanye namashidi e-foil ethusi angaphandle. Le "sandwich" ifakwa kumshini wokunyathelisa lapho ukushisa nokucindezela kuncibilikisa i-prepreg, kuhlanganisa zonke izingqimba zibe ibhodi elilodwa, eliqinile.

Isinyathelo 5: Ukubhoboza
Imigodi eqondile ibholwa ebhodini kusetshenziswa ama-drill azenzakalelayo. Le migodi izosetshenziselwa:
Izingxenye ezimbobo: Lapho kufakwa khona izintambo zezingxenye.
I-Vias: Ukudala ukuxhumana kukagesi phakathi kwezingqimba ezahlukene zebhodi.

Isinyathelo 6: Ukubeka Iplati Nokufakwa Kwethusi
Lonke ibhodi, kuhlanganise nezindonga zemigodi esanda kubholwa, lidlula enkambisweni yokubopha. Ingqimba encane yethusi ifakwa ngamakhemikhali, exhumanisa ngogesi izingqimba ezahlukene ngama-via.

Isinyathelo 7: Ukuthwebula Nokuqopha Izendlalelo Zangaphandle
Njengoba kunjalo ngeSigaba 2, izendlalelo zangaphandle zimbozwe nge-photoresist futhi zifakwe isithombe ngephethini yezendlalelo zangaphandle. Ibhodi bese liqoshwa futhi ukuze kususwe i-foil yethusi yangaphandle engafuneki, okuchaza imikhondo yesekethe yangaphandle.

Isinyathelo 8: Ukusetshenziswa Kwemaski Yesolder
Isembozo esiluhlaza okotshani (noma yimuphi omunye umbala) osibonayo ku-PCB yi-solder mask. Sifakwa phezu kwebhodi lonke bese sihlanzwa ngokukhanya kwe-UV nge-mask eshiya ama-solder pad kuphela eveziwe. Lolu ngqimba luvikela ama-trace ethusi futhi luvimbele amabhuloho e-solder ngesikhathi sokuhlanganiswa.

Isinyathelo 9: Ukuqeda Okungaphezulu
Ukuze kuvikelwe ama-copper pad avele ekungcolisweni futhi kuqinisekiswe ukuthi anamathela kahle, kufakwa ukuqeda okungaphezulu. Ukuqeda okuvamile kufaka phakathi:
I-HASL (Hot Air Solder Leveling): Ukuqeda okuvamile, okungabizi kakhulu.
I-ENIG (Igolide Elingenagesi Le-Nickel): Ihlinzeka ngobuso obuyisicaba, obumbozwe ngegolide, obuhle kakhulu ezingxenyeni ezithambile.

Isinyathelo 10: Ukuphrinta kwe-Silkscreen
Isinyathelo sokugcina ukuphrinta isikrini se-silkscreen. Lokhu kuyizinhlamvu ezimhlophe (noma ezinye imibala) ebhodini ezibonisa abaklami bezingxenye, ama-logo, amaphuzu okuhlola, kanye nolunye ulwazi oluwusizo lokuhlanganisa nokulungisa amaphutha.

Isinyathelo 11: Ukuhlolwa Kukagesi Nokuqondiswa Kokugcina
Ukuhlolwa kukagesi okuzenzakalelayo kuqinisekisa ukuxhumana kwebhodi futhi kuhlole noma yimiphi imijikelezo emifushane noma evulekile. Ekugcineni, amabhodi ngamanye akhishwa noma akhishwe kuphaneli yokukhiqiza enkulu.