Amakhono okukhiqiza e-PCB athuthukisiwe, agxile ezintweni ezinembile kakhulu, ezinzima kakhulu, nezikhethekile, akhonza izimboni ezifana nocwaningo lwesayensi, i-RF, ezempi, ezokwelapha, amarobhothi, kanye ne-AI.
I-PCB Evame Kakhulu
Iyini i-High Frequency PCB?
▶Ama-PCB anemvamisa ephezulu angamabhodi wesekethe akhethekile aphrintiwe aklanyelwe ngqo ukuphatha amasignali anemvamisa ephezulu (ngokuvamile abhekisela kuma-frequency angaphezu kuka-500MHz noma izikhathi zokuphakama kwesignali yedijithali ezingaphansi kwe-nanosecond eyodwa).
Izinkambu zohlelo lokusebenza eziyinhloko
• Ingqalasizinda yezokuxhumana: Ama-antenna, ama-amplifiers kagesi, izihlungi, kanye nama-amplifiers anomsindo ophansi eziteshini eziyisisekelo ze-5G/6G.
• Izinto zikagesi zezimoto: i-radar yamaza angamamilimitha, izinhlelo zokusiza abashayeli ezithuthukisiwe, ukuxhumana ngesathelayithi emotweni.
• Izindiza kanye nokuvikela izwe: izinhlelo ze-radar, imishini yempi kagesi, amatheminali okuxhumana ngesathelayithi, amakhanda abantu abafuna izikhali.
• Ukuxhumana ngekhompyutha okusheshayo kanye nedatha: Ama-backplane e-server/router anesivinini esikhulu, amamojula e-optical, amaswishi angu-400G/800G.
• Amathuluzi okuhlola nokulinganisa: i-network analyzer, i-oscilloscope enemvamisa ephezulu, umthombo wesignali.
Izimiso Zokukhetha Izinto Eziyinhloko
Izimpawu zemvamisa ephezulu zithinteka kalula yizakhiwo ze-dielectric kanye nokulahlekelwa yi-substrate. Ukukhethwa kwezinto kuyimbangela ye-PCBS yemvamisa ephezulu.
Uhlobo lwezinto | Amapharamitha ayisihluthulelo | Izinto/imininingwane enconyiwe | Isigcawu esisebenzayo |
Izinto eziyisisekelo | I-dielectric constant (Dk) I-tangent yokulahlekelwa yi-dielectric ye-Angle (Df) I-Coefficient of the thermal expansion (CTE) | I-substrate ezinikele kakhulu enemvamisa ephezulu -PTFE (i-polytetrafluoroethylene, i-Dk=2.1-2.6, i-Df≤0.0009) - Uchungechunge lukaRogers (njenge-RO4350B, i-Dk=3.48, i-Df=0.0037) - I-resin ye-epoxy eguquliwe (inguqulo ye-FR-4 yemvamisa ephezulu, i-Dk=3.8-4.2, i-Df≤0.01) | I-PTFE/Rogers: Igagasi le-Millimeter, i-radar, isiteshi sesisekelo se-5G I-FR-4 evame kakhulu: Ama-electronic asetshenziswa ngabathengi (omakhalekhukhwini, ama-router) |
Ifoyili yethusi | Ubulukhuni bomphezulu | Ifoyili yethusi enephrofayili ephansi (LP)/ifoyili yethusi enephrofayili ephansi kakhulu (VLP), ubulukhuni ≤1.0μm | Nciphisa ukulahleka kokudluliselwa kwezimpawu ebusweni be-foil yethusi (umphumela wesikhumba) |
Isendlalelo semaski ye-Solder | Ukulahlekelwa yi-dielectric | Uwoyela wemaski okhethekile oshiswayo ovame kakhulu (Df≤0.01) | Gwema ukwandisa ukuncishiswa kwesignali ngesendlalelo semaski ye-solder |
Amaphuzu abalulekile okuklama
▶ Ukulawula ukuvimbela okunembile
• Ingqikithi ye-PCBS evame kakhulu idinga ukulawula i-impedance yesici (njenge-impedance eyodwa engu-50Ω, i-impedance ehlukile engu-100Ω), lapho ukuphambuka kungu-≤±5% (±10% yama-PCBS ajwayelekile).
• Ukubalwa kwe-Impedance: Kuyadingeka ukuhlanganisa isisekelo sezinto uDk, ukujiya kwepuleti, ububanzi bomugqa/isikhala somugqa, kanye nokujiya kwefoyili yethusi. Kungalingiswa ngesofthiwe yobungcweti (njenge-Polar SI9000). • Isibonelo: i-RO4350B substrate (ukujiya okungu-0.254mm), kanye ne-impedance eyodwa engu-50Ω ehambelana nobubanzi bomugqa obungaba ngu-0.8mm.
• Isinxephezelo se-Impedance: Uma kucatshangelwa ithonya lokusika eceleni kanye nokumbozwa kwemaski ye-solder, inani lesinxephezelo elingu-±0.02mm kufanele ligcinelwe ububanzi bomugqa.
▶Ukulungiswa komzila
• Nciphisa ukulahleka kokudluliselwa
• Imikhondo kufanele ibe mifushane futhi iqonde ngangokunokwenzeka, igweme ama-engeli angakwesokudla noma ama-engeli abukhali (avame ukubonakaliswa kumaza aphezulu), kanti irediyasi yefillet akufanele ibe ngaphansi kuka-0.5mm.
• Imikhondo yokwehlukanisa kufanele ibe nobude obulinganayo kanye nesikhala (umehluko wobude ≤5mil), futhi kufanele kwenziwe ukwelashwa kokugoqa phansi (ibanga phakathi kwentambo yomhlabathi kanye nentambo yokwehlukanisa kufanele libe ≤2 ububanzi bomugqa) ukuze kuncishiswe ukuphazamiseka kwe-EMI.
• Impendulo yomphumela wesikhumba: Ugesi ovamise kakhulu ugxile ebusweni be-foil yethusi. I-foil yethusi efakwe isiliva ingasetshenziswa (ukunciphisa ukumelana nobuso), noma iminonjana ingandiswa (ukunciphisa ubuningi bogesi).
▶Umklamo wokubeka phansi kanye nokuvikela
• Isendlalelo esiphelele somhlabathi: Ama-PCB avame kakhulu kudingeka aklanywe nge-ground Plane ephelele (i-GND Plane) ukuze kugwenywe ukuhlukaniswa kwesendlalelo somhlabathi futhi kuncishiswe ubude bendlela yokubuya kwesignali. Ibanga phakathi kwesendlalelo somhlabathi kanye nesendlalelo sesignali akufanele libe ngaphezu kuka-0.2mm ukuze kuthuthukiswe ukuhlanganiswa nokunciphisa ukuvinjelwa.
• Izindlela zokuvikela: Ezindaweni ezibucayi ezivame kakhulu (njengezingcezu ze-RF), izembozo zokuvikela zensimbi zingaklanywa. Ukusekela kwesembozo sokuvikela kumele kube okuthembekile (amaphuzu amaningi okusekela, isikhala esingu-≤λ/20, lapho i-λ ingubude besikhathi besignali).
• Ukushabalalisa ukushisa kanye nokuhambisana nokupakishwa
• Amadivayisi anemvamisa ephezulu (njengezikhulisi zamandla) akhiqiza ukushisa okuningi, ngakho-ke ama-heat dissipation pads kanye ne-metalized ngokusebenzisa ama-array (ngobubanzi obungu-≥0.3mm, isikhala esingu-≤1mm) kudingeka aklanywe ukuze athuthukise ukushabalaliswa kokushisa.
• Ukupakishwa kwedivayisi: Beka phambili ukupakishwa kwepharamitha encane nengagcwele amagciwane (njenge-QFN, i-LGA) ukuze unciphise ukubonakaliswa kwesignali okwethulwa yiphakheji.
Ukulawulwa kwenqubo yokukhiqiza
▶Ukulawula okunembile
• Ukubekezelela ububanzi bomugqa/isikhala somugqa: ≤±0.01mm (±0.02mm kuma-PCBS ajwayelekile), kusetshenziswa ubuchwepheshe be-laser direct imaging (LDI) obunembile kakhulu ukuze kuthathelwe indawo ukuvezwa kwefilimu okuvamile.
• Ukunemba kwe-Lamination: Ukuphambuka kokuqondanisa phakathi kwezingqimba ≤0.02mm, ukugwema ukususwa kwe-impedance; Izinga lokushisa lokubopha kanye nengcindezi kudingeka kufane nezici zezinto eziyisisekelo (isibonelo, izinto eziyisisekelo ze-PTFE zidinga ukubopha okushisa okuphezulu kanye nokucindezela okuphezulu).
▶ Ukulawula ukulahlekelwa
• Inqubo yokuqopha: Ubuchwepheshe bokuqopha obuncane buyasetshenziswa ukunciphisa ukujiya kobuso be-foil yethusi nokugwema ukwanda kokulahlekelwa ukudluliswa. Ukuguguleka kwecala kungu-≤0.01mm.
• Ukwelashwa kwendawo: I-nickel gold plating engenagesi (ENIG) noma i-silver plating iyathandwa ukuze kugwenywe i-OSP (ifilimu ephilayo yandisa ukumelana nokuxhumana). Ubukhulu besendlalelo segolide kufanele bube yi-≤0.1μm. Uma ijiyile kakhulu, izokwandisa kalula ukulahlekelwa.
▶Isifinyezo esiyinhloko
• Ingqikithi ye-PCBS enemvamisa ephezulu ilele "ekunciphiseni ukulahleka kwesignali, ukuqinisekisa ukuvimba okuqondile, kanye nokunciphisa ukuphazamiseka kwe-electromagnetic". Idinga ukulawulwa kwenqubo ephelele kusukela "ekukhethweni kwe-substrate enelahleko eliphansi → ukwakheka kwe-impedance okuqondile → ukukhiqizwa okunembile kakhulu". Ezimweni ezahlukene zemvamisa ephezulu (njenge-1GHz vs 60GHz), i-substrate kanye namapharamitha enqubo kudingeka kulungiswe ngokuqondile.
Thumela umbuzo
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